ASML announced plans to collaborate with key customers on new solutions to produce cutting-edge chipmaking equipment, aiming to meet demand for large data center chips designed by companies like NVIDIA. Its current EUV lithography systems can produce chips up to 800 square millimeters, while the next-generation high-NA EUV tools offer finer resolution but are limited by smaller reticle sizes. ASML targets a pilot line with larger reticles by 2031 and mass production by 2033.
ASML says it will team up with its biggest customers to build new ways to make the most advanced chipmaking gear, aiming straight at demand for giant data center chips from companies such as NVIDIA.
Right now, ASML’s widely used extreme ultraviolet (EUV) lithography systems can make chips up to roughly 800 square millimeters in area. Its next-generation high-NA EUV lithography machines can print even finer features. But there’s a catch: the smaller reticle size currently caps the chip area they can produce.
So ASML plans to show a pilot production line using larger reticles by 2031. And the company expects the new technology to be ready for mass production by 2033.
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