NVIDIA CEO Jensen Huang is set to meet Samsung Electronics Chairman Jay Y. Lee and SK Group Chairman Chey Tae-won in New York on Sept. 28 local time, according to BlockBeats. The meeting would come about two months after the three last met in San Francisco in July. Industry attention is centered on high-bandwidth memory, or HBM, as Samsung is said to be accelerating cooperation with NVIDIA in that area. Business sources cited on Sept. 27 said Lee and Chey plan to attend the Korea Society annual dinner in New York at 6 p.m. on Sept. 28, where Huang will appear as this year’s recipient of the Van Fleet Award. The report also said Samsung Electronics Device Solutions Vice Chairman Jun Young-hyun met Huang during his June visit to South Korea, with the two discussing long-term cooperation on next-generation HBM products including HBM4E and HBM5. The New York talks may also touch on foundry services and advanced packaging, two areas the report described as Samsung strengths, as well as next-generation foundry cooperation discussed in June.
According to BlockBeats, NVIDIA Chief Executive Officer Jensen Huang is scheduled to meet Samsung Electronics Chairman Jay Y. Lee and SK Group Chairman Chey Tae-won again in New York on Sept. 28 local time.
The meeting would take place about two months after the three met in San Francisco in July. Samsung Electronics is said to be accelerating cooperation with NVIDIA in this area.
Business sources cited on Sept. 27 said Lee and Chey plan to attend the Korea Society annual dinner in New York at 6 p.m. on Sept. 28. Huang will attend the event as this year’s Van Fleet Award recipient.
The topic drawing the most attention from the industry is high-bandwidth memory, or HBM. The report said Jun Young-hyun, vice chairman of Samsung Electronics’ Device Solutions division, met Huang during Huang’s June visit to South Korea, and the two discussed long-term cooperation on next-generation HBM products including HBM4E and HBM5.
The New York meeting may also cover foundry services and advanced packaging, which the report described as Samsung’s strengths. According to the report, Jun and Huang also discussed next-generation foundry cooperation during their June talks.
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