Morgan Stanley said growth among AI semiconductor suppliers could continue to outpace broader cloud spending through 2028, even as the market expects a slowdown in data center investment. The bank pointed to sustained demand for advanced chip packaging as the key support behind that view. According to its forecast, total advanced packaging capacity is expected to rise by about 50% by 2028. Over the same period, capital expenditure growth from cloud service providers is projected at 12%. The call suggests that packaging demand, rather than headline expectations around softer data center spending, remains central to the growth outlook for AI-related chip suppliers.
Morgan Stanley said AI semiconductor suppliers may continue to grow faster than broader cloud spending through 2028, even though the market expects data center investment to slow. The bank said demand for advanced chip packaging remains strong.
It expects total advanced packaging capacity to increase by about 50% by 2028, while capital expenditure growth by cloud service providers is projected at 12%.
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