Qualcomm and Amazon strike multigenerational deal on custom AI data center chips

Qualcomm and Amazon strike multigenerational deal on custom AI data center chips

N
News Editor
2026-09-08 13:08:26
Qualcomm said on Sept. 8 that it has entered a multigenerational partnership with Amazon to build custom chips for large-scale AI data centers and to work together on AI inference. The companies are also developing optical interconnect solutions at up to 1.6T, along with next-generation technologies beyond that level. As part of the arrangement, Qualcomm plans to deepen its use of Amazon Web Services infrastructure, including Amazon Bedrock, for electronic design automation workloads with the stated goal of shortening chip design cycles. Qualcomm President and CEO Cristiano Amon said accelerating AI demand is pushing data center infrastructure to advance in both compute and connectivity. AWS Vice President Prasad Kalyanaraman said the agreement builds on an established partnership and is aimed at delivering infrastructure that is more efficient and more cost-effective for customers.

Qualcomm announced on Sept. 8 that it has entered a multigenerational partnership with Amazon to provide custom chips for large-scale AI data centers and to jointly advance AI inference.

Custom silicon and optical interconnects

Qualcomm said the two companies are also working together on optical interconnect solutions at up to 1.6T, as well as future-generation technologies beyond that level.

Broader use of AWS infrastructure for chip design

The company said it plans to expand its use of Amazon Web Services AI infrastructure, including Amazon Bedrock, for electronic design automation, or EDA, workloads. The stated aim is to shorten chip design cycles.

Executive comments

Qualcomm President and Chief Executive Officer Cristiano Amon said that as AI demand accelerates, data center infrastructure needs advances in both computing and connectivity, and that Qualcomm is pleased to work with AWS on custom chip and connectivity solutions.

AWS Vice President Prasad Kalyanaraman said the collaboration is built on a strong partnership and reflects a shared effort to deliver infrastructure that is more efficient and more cost-effective for customers.

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