Samsung Electronics has opened an advanced semiconductor packaging research and development facility in Yokohama, Japan, according to BlockBeats. The move follows a previously announced plan by the company to invest about 40 billion yen over the five years starting in 2024 to expand the lab’s research hardware and strengthen its capabilities in advanced packaging technology. Samsung said the facility will work with local Japanese companies, universities, and research institutions on next-generation packaging materials and processes. The company also plans to grow the site’s research staff to more than 100 people by 2027. The update centers on Samsung’s ongoing buildout of packaging research capacity in Japan and its collaboration plan with domestic partners in the country.
Samsung Electronics has opened an advanced semiconductor packaging R&D facility in Yokohama, Japan, according to BlockBeats.
Samsung had previously said it would invest about 40 billion yen over the five years starting in 2024 to expand the lab’s research hardware and strengthen its advanced packaging capabilities. The facility will work with local Japanese companies, universities, and research institutions to develop next-generation packaging materials and processes. Samsung plans to increase the number of researchers at the site to more than 100 by 2027.
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