SK Hynix has started construction of a $4 billion memory center in Indiana, marking the launch of a major U.S. manufacturing project tied to advanced memory packaging. The company said the Indiana facility is scheduled to begin mass production of next-generation HBM4E chips in the second half of 2029. SK Hynix CEO also said Indiana is expected to become a core production base for high bandwidth memory, or HBM, in the United States. The update centers on the site’s construction timeline, the planned HBM4E production start, and the company’s view of Indiana’s role in its U.S. memory manufacturing footprint.
SK Hynix has started building its $4 billion memory center in Indiana in the United States.
The company said its Indiana plant will begin mass production of next-generation HBM4E chips in the second half of 2029.
SK Hynix CEO said Indiana is expected to become a core production base for high bandwidth memory, or HBM, in the U.S.
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