TSMC has for the first time disclosed next year’s expansion targets for its 2nm and 3nm production capacity, according to a ChainCatcher report citing supply chain information. Monthly 2nm capacity is set to rise from 90,000 wafers by the end of this year to 110,000 wafers by the middle of next year, a 22% increase. Monthly 3nm capacity is projected to grow from more than 180,000 wafers at the end of this year to 210,000 wafers by mid-next year, up more than 16%.
The report also said TSMC’s 3nm monthly capacity reached 120,000 to 130,000 wafers at the end of last year and is expected to expand to 180,000 wafers by the end of this year before moving above 210,000 wafers by mid-next year. For 2nm, monthly capacity is expected to reach 90,000 wafers by the end of this year. TSMC did not comment on market rumors and said any capacity-related information should be based on its official disclosures. The company had previously said its 2026 capital expenditure would be between $60 billion and $64 billion, with about 70% to 80% allocated to advanced process technologies.
TSMC has disclosed its expansion targets for 2nm and 3nm production next year for the first time, according to ChainCatcher, which cited supply chain information.
Monthly 2nm capacity is expected to increase from 90,000 wafers by the end of this year to 110,000 wafers by the middle of next year, marking a 22% rise. Monthly 3nm capacity is projected to grow from more than 180,000 wafers at the end of this year to 210,000 wafers by mid-next year, an increase of more than 16%.
The report said TSMC’s 3nm monthly capacity reached 120,000 to 130,000 wafers at the end of last year. That figure is expected to expand to 180,000 wafers by the end of this year, with a target of more than 210,000 wafers by the middle of next year. For 2nm, monthly capacity is set to reach 90,000 wafers by the end of this year.
TSMC declined to comment on market rumors yesterday and said any explanation related to capacity should be based on company disclosures.
TSMC had previously said its 2026 capital expenditure would range from $60 billion to $64 billion. About 70% to 80% of that total will go to advanced process technologies. The company also plans to add three new 3nm wafer fabs in Taiwan, Arizona in the United States, and Japan, while converting 5nm equipment in Taiwan to support 3nm capacity.
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