TSMC and Samsung Electronics have committed to adopting ASML’s latest High NA EUV equipment for advanced chip manufacturing, according to a Techub News brief citing CNBC. The report said the move is aimed at meeting rising demand tied to artificial intelligence, particularly the need for smaller and more complex semiconductors. ASML’s High NA EUV, or high numerical aperture extreme ultraviolet lithography, is identified in the item as the equipment both companies plan to use. The brief does not disclose a deployment timeline, order size, or financial terms, but it frames the decision around growing semiconductor requirements linked to AI development.
TSMC and Samsung Electronics have committed to using ASML’s latest High NA EUV equipment for advanced chip manufacturing, according to Techub News, which cited CNBC.
The report said the move is intended to meet growing demand from artificial intelligence development for smaller and more complex semiconductors.
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