VIS launches first Singapore wafer fab as capacity is already sold out

VIS launches first Singapore wafer fab as capacity is already sold out

N
News Editor
2026-09-28 04:43:53
VIS, a chipmaker backed by Taiwan Semiconductor Manufacturing Co. (TSMC), held an opening ceremony on Monday for its first advanced chip manufacturing plant in Singapore, according to Nikkei. The company is already looking toward building a second facility. Demand tied to artificial intelligence infrastructure has filled the new plant’s capacity as soon as it came online. The fab, called VSMC, is a joint venture between VIS and European chipmaker NXP. It began trial production in June, only 18 months after construction started, a pace Nikkei said is much faster than the more than two years usually needed to build a chip plant. VIS said the first batch of chips reached a yield of at least 99%. The factory is scheduled to begin mass production in early 2027. The report added that the plant will also help TSMC produce interposers used in advanced chip packaging, which act as substrates linking different types of chips for leading AI chip companies including Nvidia, Google and Broadcom. TSMC is VIS’s largest shareholder with a stake of about 19%.

VIS, a chip manufacturer backed by Taiwan Semiconductor Manufacturing Co. (TSMC), held an opening ceremony on Monday for its first advanced chip manufacturing plant in Singapore, Nikkei reported. The company is also looking ahead to a second factory.

Driven by strong demand for artificial intelligence infrastructure, the new plant’s capacity was already sold out as soon as it came online. The fab, known as VSMC, is a joint venture between VIS and European chipmaker NXP.

The plant started trial production in June. It took 18 months to move from groundbreaking to pilot production, much faster than the more than two years typically required to build a chip factory. VIS said the first batch of chips achieved yields of at least 99%. The facility is scheduled to begin mass production in early 2027.

The report said the plant will also help TSMC produce key interposers for advanced chip packaging. These are used as substrates to connect different types of chips and serve leading AI chipmakers including Nvidia, Google and Broadcom. TSMC is VIS’s largest shareholder, holding about 19%.

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