A14

TSMC
2026-09-21 00:22:34

TSMC speeds up Central Taiwan fab buildout for A14 process, report says

Taiwan Semiconductor Manufacturing Co. is accelerating construction of four fabs in Central Taiwan Science Park to support its 1.4-nanometer A14 process, according to a report cited by ChainCatcher from Commercial Times. As of early September 2026, work on the Phase 2 P1 plant was progressing smoothly, with completion expected in April 2027, followed by equipment move-in and trial production. The P2 plant is moving ahead in parallel and is expected to complete equipment tuning with P1 and reach readiness for mass production before the end of 2027. The report said all four 1.4 nm wafer fabs at the site are expected to be completed in the second quarter of 2028 and enter large-scale mass production. Major customers said to have reserved A14 capacity include Apple, NVIDIA, AMD, Qualcomm, MediaTek, Broadcom and cloud service providers. Monthly capacity is estimated at 120,000 to 160,000 12-inch wafers, with projected annual revenue contribution to TSMC of $45 billion to $52 billion.

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TSMC speeds up Central Taiwan fab buildout for A14 process, report says
TSMC
2026-08-24 02:01:13

Report says TSMC may spend over NT$30 billion to buy two AUO plants near its Central Taiwan Science Park site

TSMC is rumored to be considering a purchase of two older-generation AUO display plants near its operations in the Central Taiwan Science Park, according to a report cited by ChainCatcher from Commercial Times. The reported deal value is more than NT$30 billion, and the facilities — AUO’s L7 and L5C plants — would be kept as space for large-format packaging development tied to CoPoS and FOPLP. People familiar with the matter, as cited in the report, said TSMC has already completed on-site due diligence. AUO is said to be planning to prioritize the disposal of the two factory sites, with a board submission target in October and a goal of finishing production-line relocation and clearing the facilities by the end of the first quarter next year. Neither TSMC nor AUO has confirmed the transaction. The report also described a broader buildout in central Taiwan. Industry sources said TSMC is extending its footprint from A14 process technology and advanced packaging to the COUPE silicon photonics platform, while existing and planned sites in the park include Fab 15A, Fab 25 and the AP5 advanced packaging and testing facility. On the optics side, Largan has recently acquired land and factory properties in Taichung, with the market reading those moves as preparation for CPO-related volume production.

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Report says TSMC may spend over NT$30 billion to buy two AUO plants near its Central Taiwan Science Park site
TSMC
2026-08-12 03:47:27

TSMC says 5.5x reticle CoWoS is in mass production, flags ABF substrates as next constraint

Taiwan Semiconductor Manufacturing Co. said its 5.5x reticle-size CoWoS packaging has entered mass production, with yields holding above 98% and some products topping 99%, according to comments made publicly on Aug. 11 by Vice President of Advanced Packaging Ho Chyun. He said the company aims to scale CoWoS to 14x reticle size by 2029, while also pushing SoIC hybrid bonding from a 6-micron pitch already in production to 4.5 microns by the same year. Ho said TSMC’s CoWoS capacity has nearly doubled every year over the past three years and that the company now operates 10 advanced packaging fabs globally. Supply is now much closer to customer demand, he said, though it still has not fully caught up. He also pointed to a new supply-chain strain for AI hardware. After memory, ABF substrates are likely to become the next major bottleneck, he said. In his view, multisourcing does not fully solve the problem because substrate differences across suppliers can complicate coplanarity control and hurt yields during system integration. Ho also called for broader industry coordination through the Open Compute Project to build system-level validation standards and speed AI product development and ramp-up.

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TSMC says 5.5x reticle CoWoS is in mass production, flags ABF substrates as next constraint
Robinhood Cha
2026-08-11 09:24:42

STONKBROKER Early Buyer Turns $5,080 Into About $407,000 in Unrealized Gains Without Selling

STONKBROKER, a meme coin on Robinhood Chain, climbed to an all-time high of $0.0389903 early on Aug. 11, posting a 19.22% gain over 24 hours and a 127.22% rise over seven days. Chain data cited in the source article shows that wallet 0x8671DF…b93e8 built its position at an average cost of $0.0004373, spending a total of $5,080 to accumulate 11,615,621 tokens. The address has no recorded outgoing STONKBROKER transfers and, at the time referenced in the article, still had not sold any of its holdings. According to Blockscout records reviewed by BlockTempo, 93.2% of that wallet’s position was accumulated in less than four minutes on July 18, with the remaining purchases spread between July 21 and Aug. 10. The article also noted that the holder added another 20,106 tokens on Aug. 10. Using CoinGecko’s quoted price of $0.035496 at press time, the position was worth about $412,000, implying roughly $407,000 in unrealized profit and a return of about 8,017%. The report also distinguished between STONKBROKER’s circulating market cap of $55.63 million and its fully diluted valuation of $96.43 million, and pointed out that liquidity conditions could make it difficult to fully realize the paper gain in one sale.

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STONKBROKER Early Buyer Turns $5,080 Into About $407,000 in Unrealized Gains Without Selling
TSMC
2026-08-10 03:22:03

Longtan science park expansion restarts as TSMC signals interest in 1.4 nm fabs

The long-delayed third-phase expansion of the Longtan Science Park has been revived after more than two years of setbacks tied to land expropriation disputes. According to ABMedia, citing a Liberty Times report, local sentiment in Longtan shifted after residents saw the economic spillover created by Taiwan Semiconductor Manufacturing Co. (TSMC) plants in southern Taiwan, including Tainan, Kaohsiung, and Chiayi. Supply chain sources said TSMC is planning three facilities for the site: two 1.4 nm wafer fabs and one panel-level packaging, or PLP, plant. The project was originally designed to cover 158.59 hectares, with 88% of the land privately owned, triggering strong opposition and organized protests. TSMC later announced on Oct. 17, 2023 that it would abandon its Longtan plant plan. Since then, the project scope has been revised several times, first to 89.63 hectares in 2024 and later to 104.19 hectares, of which about 46 hectares are designated for industrial use. Taiwan’s National Science and Technology Council said the expansion plan passed review by the Science Park Review Committee in May and was submitted to the Executive Yuan in June. Under the current timetable, land acquisition is targeted for completion by the end of 2029, with public infrastructure construction scheduled to begin in 2030.

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Longtan science park expansion restarts as TSMC signals interest in 1.4 nm fabs
YOM
2026-07-24 06:00:16

YOM Token TGE Delayed by EU MiCA Review, Team Eyes April 2026 Update

YOM has delayed its token generation event due to EU MiCA compliance steps, including regulatory review and DTI/LEI registration. The Avalanche C-Chain contract is already live, while the new launch timeline will be announced after approvals and exchange integrations are completed.

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YOM Token TGE Delayed by EU MiCA Review, Team Eyes April 2026 Update