EMIB-T

Intel

2026-08-10 06:31:55

Intel EMIB-T Packaging Faces Yield Hurdles, 50% Target for 2027 Mass Production

Intel's next-generation EMIB-T advanced packaging technology is confronting serious yield challenges, according to Taiwanese media reports. Unimicron said at its July 29 earnings call that the technology is 'not yet mature,' with three EMIB-T substrate suppliers targeting just 50% yield for initial mass production by the end of 2027. Google's ninth-generation TPU is set to adopt EMIB-T for 2028 production, with MediaTek handling co-design.

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Intel

2026-08-04 08:15:44

Intel’s EMIB-T nears 90% yield with packaging costs about half of TSMC CoWoS

Intel’s EMIB-T advanced packaging technology is moving closer to commercialization, with industry sources cited by ABMedia saying packaging yield is approaching 90% and total packaging quotes are roughly 40% to 50% below Taiwan Semiconductor Manufacturing Co.’s CoWoS offering. The design replaces the large silicon interposer used in CoWoS with an embedded silicon bridge inside an organic substrate, and the EMIB-T version adds through-silicon vias, or TSVs, to route power and high-speed signals vertically for 3D stacking. The report said packaging-side maturity is already high, while substrate production remains the main obstacle. Substrate yield is still around 50%, making it the key technical bottleneck before volume production. EMIB-T is expected to enter formal mass production in 2027, with ASIC makers and developers of CPU-based AI chips seen as the main target customers because of the lower cost profile. ABMedia also said Intel is pushing ahead with its Ohio wafer fab project, a more than 1,000-acre manufacturing site tied to the company’s Angstrom-generation 18A and 14A nodes. Wccftech said Intel has begun paying overtime bonuses to on-site workers as it works toward large-scale 14A production in 2031.

3050

Nomura Securi

2026-07-16 03:32:36

Nomura flags record May substrate shipments in Japan as Rubin ramp and HBM4 packaging shifts draw focus

Nomura Securities said in a July 14, 2026 research note, citing data from Japan’s Ministry of Economy, Trade and Industry, that Japanese package substrate shipments reached JPY 27.8 billion in May, up 36% from a year earlier and marking a record high. Shipment area rose 10% per square meter, while average pricing climbed 23% to JPY 1.356 million. The report said packaging demand tied to NVIDIA’s Rubin platform is expected to ramp this summer, with August seen as the latest point for volume expansion. Nomura added that the bigger variable may be a possible shift in Rubin Ultra from a four-die structure to a dual-module design, alongside the integration challenges created by HBM4 routing upgrades and larger interposers. The note also pointed to Intel’s EMIB-T announcement at ECTC, which is expected to be ready for mass-production preparation in 2026 and could integrate as many as 12 HBM4 stacks without an interposer, while improving voltage drop by 68% to 80% versus EMIB. TSMC, Nomura said, remains ahead through its 3DFabric Alliance and advantages in power delivery and thermal management.

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