Intel

Donald Trump

2026-10-04 05:15:37

Trump says the U.S. government could possibly take stakes in OpenAI and Anthropic

U.S. President Donald Trump said in a Time interview that Washington could "maybe" take stakes in OpenAI and Anthropic, echoing the structure he used to describe the government’s Intel deal. The remark came after Anthropic CEO Dario Amodei met Trump at the White House for a dinner that reportedly lasted more than two hours. In the same interview, Trump praised Amodei, rejected the idea of nationalizing leading AI labs, and argued against ex-ante regulation, saying the guardrails should come from the Department of Justice and the FBI after problems emerge. The report also revisits the Intel transaction Trump cited as a model. According to the article, the U.S. government subscribed to about 433 million newly issued Intel shares at $20.47 each in August 2025, taking roughly 9.9% for $8.9 billion by converting previously approved but undisbursed CHIPS Act subsidies and Secure Enclave funding into equity. BlockTempo then contrasts that structure with Anthropic’s much larger scale, citing Bloomberg’s report that the company is targeting a valuation of about $2 trillion and up to $100 billion in fundraising ahead of a possible Thanksgiving listing. The article says any similar arrangement would raise questions about leverage, valuation, public opinion, and the line between regulator and shareholder.

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U.S. after-ho

2026-10-01 06:22:49

Chip stocks rise in U.S. after-hours trading, with SOXL up more than 9%

Chip-related names moved higher in U.S. after-hours trading, according to market data cited by ChainCatcher from Gate. The biggest gain in the group came from the Direxion Daily Semiconductor Bull 3x Shares ETF, or SOXL, which rose more than 9%. Arm gained 4%, while Advanced Micro Devices (AMD) and Intel each climbed more than 3%. Other semiconductor names also posted gains. SanDisk rose 2.8%, SK Hynix added 2.7%, Broadcom advanced 1.6%, Nvidia gained 1.5%, and Micron Technology rose 1.4%. The move reflected broad strength across chip stocks during the U.S. night session, with both individual semiconductor companies and a leveraged sector ETF trading higher.

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Intel

2026-09-30 17:57:44

Intel adds Nvidia OpenShell policy layer to its AI agent toolkit

ChainCatcher reported that Intel (INTC.O) has added Nvidia’s (NVDA.O) OpenShell policy layer to its AI agent toolkit. The brief update points to a new integration involving the AI software stacks of the two chip companies. The source did not provide additional details on rollout timing, product scope, technical specifications, or which parts of the toolkit will use the OpenShell policy layer. No further comments or supporting information were included in the original newsflash.

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US stocks

2026-09-30 13:48:11

Semiconductor and storage names split at the U.S. open, while Neocloud stocks fell broadly

U.S. stocks opened with mixed moves across semiconductor names on Sept. 30, according to market data from BIT (bit.com). Intel led the gainers in the group, rising 2.50%, while Nvidia, Qualcomm and Lam Research also traded higher. Arm and Marvell Technology moved lower. Storage stocks also showed a split performance, with Micron Technology and SanDisk posting gains, while Western Digital and SK Hynix slipped. In contrast, optical communications names were mostly in the red, including Corning, Coherent, Applied Optoelectronics and Ciena. Neocloud-related stocks also came under pressure across the board. Hut 8 posted the steepest decline among the names listed, followed by Cipher Digital, Applied Digital and TeraWulf. The snapshot reflects opening moves in several technology-linked groups that are closely watched by crypto market participants because of their overlap with AI infrastructure, data center demand and digital asset mining exposure.

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Intel

2026-09-30 07:51:51

Intel patent outlines MicroLED integration inside CPU packages using glass substrates and TGVs

Intel has secured a U.S. patent describing how MicroLEDs could be embedded directly inside a CPU package, with glass substrates and through-glass vias, or TGVs, serving as the key interconnect structure. According to Tom’s Hardware, the patent was filed in 2022 and proposes linking MicroLEDs to semiconductor dies either directly or through nanowires, while power and signals are routed through the glass substrate. The concept could allow processors to display text or status indicators on-package, support simple diagnostic signaling, or enable cosmetic lighting effects. The filing also ties into broader packaging trends around glass-core substrates and co-packaged optics, or CPO. Intel has been developing glass substrate technology since the early 2010s, and this year showed related engineering samples at NEPCON Japan and a 24-layer glass core panel at ECTC. The report notes that market attention is less on decorative lighting and more on whether the packaging approach could eventually support optical integration inside advanced chip packages. Still, the patent does not describe optical interconnects or high-speed optical communications, and there is no indication that Intel will commercialize the design in a processor product.

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Intel

2026-09-30 04:31:11

Channel survey says Intel’s real pressure comes from 18A yields and AI agent demand, not NVIDIA Vera

A channel survey cited by ABMedia says NVIDIA’s in-house Vera CPU is unlikely to displace major x86 server CPU customers in the near term, even as it adds a new variable to the server market. The report instead points to Intel’s 18A process yields, fresh “outside-the-rack” CPU demand tied to AI agent workloads, and the durability of server market growth into 2027 as the factors that will shape competition with AMD. The survey estimates Intel’s server CPU share will fall to about 57% in 2026 from 65% in 2025, with AMD at roughly 30% and hyperscalers’ in-house chips at about 13%. It says Intel has lifted pricing on high-end 18A SKUs while shifting its mix toward higher-tier products, pushing second-quarter server CPU ASP up about 48% year over year even as shipments rose only around 10%. The same survey argues that 18A yield levels and the ramp of Fab 62 matter more than Vera in the near term. It also sees AI agent infrastructure creating a potentially large pool of demand for mid- to high-end server CPUs outside GPU-heavy training and inference racks, with optimistic 2027 demand reaching 1 million to 2 million units.

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ASML

2026-09-29 08:19:18

ASML says Europe has almost no sales as EUV orders stretch into 2028

ASML Chief Financial Officer Roger Dassen said on a recent call that the Dutch lithography company has "almost no sales" in Europe, even though it is the only supplier of extreme ultraviolet, or EUV, lithography systems. He also said the U.S. has asked whether part of ASML’s R&D could be moved there, while China and India have been extending invitations of their own. The report says ASML’s EUV machines sell for roughly $150 million to $300 million each, while next-generation High-NA tools are priced at about $400 million per unit. ASML expects to ship around 65 Low-NA EUV systems in 2026 and raised its net sales guidance for that year to €43 billion to €45 billion. The company said EUV capacity for 2027 is close to full, with output set to rise 30% to 85 units, and a meaningful number of orders already on the books for 2028. The article argues that Europe’s problem is not a lack of semiconductor companies, but a lack of domestic advanced-node logic design, foundry capacity, and customers that actually need EUV. It also points to the European Union’s €43 billion Chips Act, a 2025 special report from the European Court of Auditors calling the bloc’s 2030 production target "very unlikely," and delays or scale-backs in Intel’s projects in Germany and Ireland as signs of a wider structural gap.

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Shenzhou Shar

2026-09-29 00:35:13

Shenzhou Semiconductor updates STAR Market prospectus, seeks RMB 2.52 billion with Intel and YMTC-linked fund among shareholders

Jiangsu Shenzhou Semiconductor Technology Co., Ltd., or Shenzhou Shares, has updated its prospectus for a planned listing on Shanghai’s STAR Market. The company said it aims to raise RMB 2.52 billion and allocate the proceeds across five areas: RMB 850 million for R&D and industrialization of power-related components used in integrated circuits at advanced process nodes, RMB 271 million for expanding its technical support service system, RMB 535 million for a Shanghai industrialization base, RMB 556 million for a technology R&D and innovation center, and RMB 310 million for working capital. The prospectus shows revenue of RMB 261 million in 2023, RMB 446 million in 2024, and RMB 654 million in 2025. Net profit was negative RMB 22.32 million in 2023, then RMB 136 million in 2024 and RMB 210 million in 2025. For the first half of 2026, revenue reached RMB 376 million, with net profit at RMB 117 million and non-recurring-adjusted net profit at RMB 109 million. The filing also details customer concentration, inventory and receivables, and control arrangements centered on chairman and general manager Zhu Peiwen, who controls 64.74% of voting rights. Intel Asia Pacific R&D Ltd. and Changxin Storage Industry Investment Fund (Wuhan) are listed among pre-IPO shareholders.

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