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2026-08-24 06:06:30

Semi Analysis flags V5 Technologies as an early CoPoS inspection play in advanced packaging

Semi Analysis said V5 Technologies has emerged as one of the main beneficiaries in the CoWoS supply chain and has already moved into Taiwan Semiconductor Manufacturing Co.’s next-generation CoPoS process. The report argues that rising packaging density in AI chips is turning yield control into a central issue for TSMC and outsourced semiconductor assembly and test providers, sharply lifting demand for optical inspection tools. According to the report, V5 Technologies’ V530 Pro platform uses in-house AI image recognition algorithms and high-speed imaging hardware to detect surface defects in advanced packaging, including contamination, scratches and process residue. The company posted about NT$2.08 billion in consolidated revenue in 2025, up 188% year over year, while earnings per share reached NT$14.04, a record high. Monthly revenue in the first half of 2026 continued to hit new highs as customers expanded CoWoS, 3D packaging and panel-level packaging capacity. Semi Analysis also identified CoPoS as V5 Technologies’ next growth engine. The company has launched four CoPoS machine models, compared with two for CoWoS, and estimates total inspection demand for CoPoS at roughly twice that of CoWoS. Its demo systems are already undergoing customer testing, with three panel-level packaging customers in talks. V5 expects customer qualification as early as the fourth quarter of 2026 and volume shipments in 2027.

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Semi Analysis flags V5 Technologies as an early CoPoS inspection play in advanced packaging