Semiconductor equipment supplier Applied Materials and Dutch semiconductor equipment company Besi have announced an expanded partnership focused on AI chip packaging technology, according to a Techub News brief citing Crypto Briefing. The companies said the broader collaboration is aimed at accelerating progress in AI chips. The report adds that the effort could affect data processing speeds and energy efficiency across the technology sector. No financial terms or timeline for the expanded partnership were disclosed in the source brief. The item was published by Techub under its technology category.
Semiconductor equipment supplier Applied Materials and Dutch semiconductor equipment company Besi have expanded their partnership to push forward AI chip packaging technology, according to a Techub News brief citing Crypto Briefing.
The collaboration is intended to speed up progress in AI chips and could affect data processing speeds and energy efficiency in the technology sector, the report said.
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