Changdian Technology, China's leading semiconductor packaging and testing firm, announced on September 7 a plan to raise up to 65 billion yuan ($968 million) via a private placement. The funds will be used to expand advanced packaging capacity for AI chips, including high-density system-in-package and wafer-level packaging production lines, to meet orders from Nvidia and AMD. The company noted that AI chips demand higher bandwidth and heat dissipation in packaging, pushing existing capacity near full utilization. The plan is subject to shareholder and regulatory approval.
Changdian Technology Plans $968M Fundraising for AI Chip Packaging Capacity
Changdian Technology, China's leading semiconductor packaging and testing company, on September 7 announced a plan to raise up to 65 billion yuan ($9.68 billion) through a private placement of shares. The proceeds will be directed toward expanding advanced packaging capacity for AI chips and related technology research and development.
The investment will primarily go to building production lines for high-density system-in-package (SiP) and wafer-level packaging (WLP) tailored for AI computing chips. The expansion aims to address growing demand from clients such as Nvidia and AMD. Changdian said that AI chips require significantly higher bandwidth and better heat dissipation capabilities in packaging, and its current capacity is already operating near full load.
The fundraising plan still requires approval from the shareholders' meeting and regulatory authorities. No timeline for the approvals was disclosed.
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