Analyst says Chinese DRAM makers may advance 3D DRAM development by 2027

Odaily reported that Citrini analyst jukan said in a post on X that Goldman Sachs had spoken with a Chinese DRAM industry expert, who shared a view on pricing, product development, and capacity expansion among Chinese suppliers. According to that expert, Chinese DRAM vendors may be able to price their products at levels comparable to global leaders, even though yields could be lower. The same expert said Chinese DRAM manufacturers may make further progress in 3D DRAM product development in 2027. On production, capacity expansion projects underway in Hefei, Shanghai, and Beijing are expected to come fully online in 2028. The expert also said some wafer fabs are said to rely mainly on domestically produced Chinese equipment, with the exception of high-end tools such as lithography systems.