Citrini says Korean chipmakers remain cautious on 3D IC commercialization as CXMT targets custom memory niches

News Editor

2026-07-25 09:12:58

Citrini analyst Jukan, citing a recent industry analysis from ZDNet Korea, said the AI semiconductor race is shifting away from process-node scaling and toward advanced stacking technologies, with 3D IC emerging as a key next-generation approach for vertically integrating logic and memory. He said Samsung Foundry has recently seen a surge in inquiries about 3D IC, with nearly every potential customer asking about the technology. Even so, Jukan argued that 3D IC is fundamentally customized DRAM made to order, which clashes with the core business model of Samsung and SK hynix, both of which are built around standardized products and large-scale volume production. In his view, the two Korean memory makers are likely to keep their work limited to early-stage research and stay cautious about broad commercialization. That hesitation, he said, is creating an opening for niche players. With U.S. semiconductor restrictions making it difficult for China’s CXMT to enter the HBM market, the company is pursuing 3D IC as a differentiated path, focusing on custom memory instead of taking on Korean suppliers directly in commodity DRAM. A Korean semiconductor industry official said China is already ahead in producing multiple 3D DRAM sample chips, and that companies such as CXMT and Winbond may be the ones to establish this market first.

CitriniJukan3D ICCXMTSamsungSK hynixAI semiconductorsNiche market

On July 25, Citrini analyst Jukan, citing a recent industry analysis from ZDNet Korea, said the AI semiconductor performance race is moving away from process-node shrinkage and toward advanced stacking technology. In that shift, 3D ICs, which vertically integrate logic and memory, are becoming a key next-generation technology.

Korean memory makers are seeing demand, but not rushing into full commercialization

Jukan said Samsung Foundry has recently received a sharp rise in 3D IC inquiries, with nearly every potential customer asking about the technology. Still, he argued that 3D IC is, at its core, made-to-order DRAM, and that creates a basic conflict with the core business model at Samsung and SK hynix, which is centered on standardized products and large-scale mass production.

Because of that mismatch, Jukan expects the two Korean companies to keep their efforts largely at the level of preliminary research while remaining cautious about full-scale commercialization.

CXMT is using 3D IC as a differentiated route

According to the analysis cited by Jukan, that structural hesitation is opening a window for niche players. ChangXin Memory Technologies, or CXMT, has found it difficult to enter the HBM market because of U.S. semiconductor restrictions. As a result, the company is treating 3D IC as a differentiated path forward, targeting custom memory rather than competing head-on with Korean suppliers in commodity DRAM.

A Korean semiconductor industry official said China is already ahead in producing multiple 3D DRAM sample chips. The official added that niche-market participants such as CXMT and Winbond are likely to be the first to build out this market.

Jukan also pointed to a broader shift in AI memory competition

Jukan had previously said that NVIDIA’s CUDA moat is coming to an end. He said the breakdown of software-ecosystem barriers is unfolding at the same time as the move toward 3D IC customization, and that the next phase of competition in AI memory could face a structural reshuffle.

The report also noted that a niche market refers to a segment within a larger market that mainstream players have ignored or chosen not to enter, while niche players are companies focused on that segment.

This article was originally published by Bit.Fan. For more cryptocurrency news and market insights, visit www.bit.fan.

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