Samsung Electronics plans to fully exit its 8-inch wafer foundry business by 2030 and redirect its strategic focus to 12-inch advanced process technologies, according to a report by South Korean tech media outlet TheElec. The company is expected to gradually scale down its 8-inch production lines as part of that transition.
The first major step will be the closure of the S7 plant in the Giheung complex in the second half of 2026. That facility has monthly capacity of about 50,000 wafers. After the S7 shutdown, Samsung’s total monthly 8-inch wafer capacity is expected to fall from 250,000 wafers to below 200,000.
The report also said utilization rates at Samsung’s remaining S6 and S8 plants had dropped to around 70% at that point. Samsung foundry head Han Jin-man previously said the 8-inch foundry market had become increasingly crowded and price-driven, and that the company planned to gradually reduce its exposure to the segment.
Samsung Electronics plans to fully exit its 8-inch wafer foundry business by 2030 and shift its strategic focus to 12-inch advanced process technologies, according to South Korean tech media outlet TheElec.
The company will gradually scale down its 8-inch production lines. The S7 plant in the Giheung complex is set to be the first to close, with the shutdown planned for the second half of 2026. The facility has monthly capacity of about 50,000 wafers.
Once S7 is closed, Samsung’s total monthly 8-inch wafer capacity will fall from 250,000 wafers to below 200,000. At that point, utilization rates at the remaining S6 and S8 plants had dropped to around 70%.
Han Jin-man, head of Samsung’s foundry business, previously said the 8-inch foundry market had become increasingly crowded and driven by price competition, and that the company planned to gradually reduce the business.
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