SK Hynix is studying ways to deepen cooperation with storage chip customers and suppliers in Japan, according to CEO Kwak Noh-Jung. He said the company is also cautiously reviewing how the NAND flash market could be developed jointly. On SK Hynix’s significant indirect interest in Kioxia, Kwak said there is currently "no definite plan." After Toshiba cut its stake this month, BCPE Pangea Cayman2, the investment vehicle through which SK Hynix holds the related shares, became Kioxia’s largest shareholder with a 14.19% stake. SK Hynix holds bonds convertible into nearly all voting rights of that vehicle, though an earlier agreement caps its voting rights at under 15% through 2028 unless Kioxia agrees otherwise. Separately, the company is investing more than $4 billion to build its first U.S. HBM packaging base in Indiana. The clean room is expected to begin operations in October 2028, with next-generation HBM mass production planned for the second half of 2029. The site is expected to employ about 1,000 people once fully operational. SK Hynix is also still evaluating a potential listing for its U.S. NAND subsidiary Solidigm, but has not made a decision.
SK Hynix is studying ways to deepen cooperation with storage chip customers and suppliers in Japan, CEO Kwak Noh-Jung said on Aug. 28, according to BlockBeats. The company is also cautiously evaluating how the NAND flash market could be developed jointly.
No definite plan on Kioxia-related interest
Asked about SK Hynix’s significant indirect interest in Kioxia, Kwak said there is currently "no definite plan."
After Toshiba reduced its stake this month, BCPE Pangea Cayman2, the investment vehicle through which SK Hynix holds the related shares, became Kioxia’s largest shareholder with a 14.19% stake. SK Hynix holds bonds convertible into nearly all voting rights of that vehicle. Under an earlier agreement, its voting rights cannot exceed 15% before 2028 unless Kioxia gives its consent.
U.S. HBM packaging base moves ahead
Beyond its Japan-related cooperation plans, SK Hynix is also moving ahead with a U.S. project. The company is investing more than $4 billion to build its first U.S. HBM packaging base in Indiana.
The plant’s clean room is expected to start operations in October 2028. Mass production of next-generation HBM is planned for the second half of 2029. Once the site is fully operational, it is expected to employ about 1,000 people.
Solidigm listing still under review
SK Hynix also said it is still evaluating the possibility of listing its U.S. NAND subsidiary Solidigm, but no decision has been made.
This article was originally published by Bit.Fan. For more cryptocurrency news and market insights, visit www.bit.fan. Disclaimer:
The market information, project data, and third-party content displayed on this platform are for industry information sharing only and do not constitute any form of investment advice or return commitment.
Cryptocurrency trading carries high risks. Users should fully assess their risk tolerance and make independent decisions. All profits, losses, and legal responsibilities are borne by the users themselves.
