SK Hynix is increasing the scale of outsourced flip-chip packaging for its memory semiconductor business. After working with OSAT provider A-PROTECH, the company has started assigning more packaging work to Winpac, marking a renewed partnership between the two companies four years after their previous collaboration. Under the plan, part of SK Hynix’s packaging orders for DDR4 and DDR5 DRAM memory chips will be handled by Winpac. The company has completed equipment tuning and other production-line preparations at its packaging plant in the P complex and has now moved into mass production. The complex is responsible for packaging high-performance products including DRAM, NAND flash, and embedded Universal Flash Storage, or eUFS. Its monthly capacity has increased from 44 million units to 50 million units, according to the report cited by Odaily.
SK Hynix is expanding outsourced flip-chip packaging for memory semiconductors, according to a report carried by Odaily.
After working with OSAT, or outsourced semiconductor assembly and test, supplier A-PROTECH, SK Hynix has begun assigning more business to Winpac. The move marks a renewed partnership between the two companies four years after their previous collaboration.
Under the plan, part of SK Hynix’s packaging orders for DDR4 and DDR5 DRAM chips will be handled by Winpac. Winpac has completed equipment tuning and other production-line preparations at its packaging plant in the P complex and has now entered mass production.
The complex handles packaging for high-performance products including DRAM, NAND flash, and embedded Universal Flash Storage (eUFS). Its monthly capacity has risen from 44 million units to 50 million units.
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