SK hynix said on Aug. 4 that it has jointly released the first standard specification for High Bandwidth Flash, or HBF, with Sandisk. The move marks the first outcome from the companies’ standardization effort around the next-generation storage technology. According to the announcement, the two sides began working on HBF standardization in August last year and later formed an alliance in February this year. About six months after that alliance was established, they have now published the initial specification.
The standard sets out two capacity configurations based on 8-layer and 16-layer NAND chip stacks, with support for up to 512GB. It also defines bandwidth requirements across three tiers, Grade 1 through Grade 3, covering data transfer performance from about 0.4TB/s to 3.0TB/s. The specification provides an early framework for how HBF could be structured as a storage technology standard.
SK hynix said on Aug. 4 that it has jointly released the first standard specification for High Bandwidth Flash, or HBF, with Sandisk.
The company said the release is the first result of the two sides’ work on HBF standardization. SK hynix and Sandisk began their standardization cooperation in August last year, and an alliance was established in February this year. The specification was published about six months later.
The standard defines two capacity configurations using 8-layer and 16-layer NAND chip stacking, with support for up to 512GB. It also sets bandwidth benchmarks across three tiers, Grade 1 to Grade 3, covering data transfer capability from about 0.4TB/s to 3.0TB/s.
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