The US has announced a proposed $874 million investment package for semiconductor research and development, according to a July 29 update carried by BlockBeats and attributed to Jin10. The stated aim is to strengthen domestic chip technology research capabilities. At the same time, US authorities said wafer foundry company GlobalFoundries could receive up to $300 million in government support. The funding is intended to back the company’s semiconductor R&D work as well as the buildout of advanced manufacturing capabilities. The announcement ties a broader national investment plan to a specific company-level funding commitment, with GlobalFoundries named as a beneficiary under the proposal. No additional timetable or implementation details were disclosed in the brief.
The US has announced a proposed $874 million semiconductor research and development investment package, according to a July 29 update published by BlockBeats and attributed to Jin10.
The plan is aimed at strengthening domestic chip technology research capabilities in the United States.
US authorities also said wafer foundry company GlobalFoundries will be eligible for up to $300 million in government funding. The support is intended for semiconductor R&D and the development of advanced manufacturing capacity.
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