Xiaomi unveils 3nm Xring O3 chip made by TSMC, with initial volume seen at 200,000 to 300,000 units

Xiaomi unveils 3nm Xring O3 chip made by TSMC, with initial volume seen at 200,000 to 300,000 units

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News Editor
2026-08-25 02:59:23
Xiaomi on Monday introduced its in-house flagship smartphone chip, the Xring O3, built on a 3nm process and manufactured by Taiwan Semiconductor Manufacturing Co. The launch marks a deeper push into self-developed silicon after the company’s 2025 Xring O1, and puts fresh pressure on long-time suppliers Qualcomm and MediaTek in the high-end mobile SoC market. According to Xiaomi, the Xring O3 delivers more power-efficient imaging and stronger on-device AI computing. The company also released the Xring O100 and D100 alongside it. Specifications disclosed in the report show a 133 sq mm die with more than 24 billion transistors, LPDDR6 support, 113.8GB/s memory bandwidth, a 10-core CPU, and a 16-core G2-Ultra NX GPU. Xiaomi said multi-core performance improved about 60% from the previous generation, while GPU performance rose as much as 85% and energy efficiency improved 64%. Still, Bloomberg Intelligence analysts Steven Tseng and Rebecca Wang said the chip’s reported shipment target of only 200,000 to 300,000 units suggests Xiaomi remains far from replacing Qualcomm and MediaTek at scale. The first phone to use the chip will be the Xiaomi 18 Fold, scheduled for release in September 2026.

Xiaomi on Monday launched its in-house flagship smartphone processor, Xring O3, built on a 3nm process and manufactured by Taiwan Semiconductor Manufacturing Co. The move takes aim at Qualcomm and MediaTek, which have supplied core mobile components to Xiaomi for more than a decade. Bloomberg said the chip’s reported shipment target is only 200,000 to 300,000 units, pointing to limited near-term scale.

Xiaomi expands its in-house chip strategy

In a post on its official Weibo account, Xiaomi said Xring O3 brings more power-efficient image processing and stronger on-device AI computing. The release is another step in the company’s internal chip effort after the Xring O1 in 2025.

Xiaomi also introduced the Xring O100 and D100 at the same event. A system-on-chip, or SoC, combines the processor, graphics chip and AI computing unit on a single piece of silicon. It is the most expensive core component in a smartphone and one of the main factors shaping device performance. For more than a decade, that part of the market has been dominated by Qualcomm and MediaTek.

3nm process and technical details

Xiaomi founder Lei Jun said in a WeChat post that the Xring O3 uses a 3nm process. The report said that node is close to the technology used in Apple’s latest A19 Pro chip and puts Xiaomi ahead of Huawei’s in-house chip effort on that measure.

According to Reuters, TSMC is producing the chip. The report described this as the first time Xiaomi’s in-house chip program has been clearly tied to TSMC manufacturing.

The Xring O3 has a die size of 133 square millimeters and more than 24 billion transistors. Xiaomi said it is the world’s first mobile processor compatible with LPDDR6 memory, with memory bandwidth of 113.8GB per second, up 48% from the previous Xring O1.

The CPU uses a 10-core design: two C1-Ultra cores clocked up to 4.35GHz, four C1-Premium cores at 3.68GHz, and four C1-Pro cores at 3.15GHz. The GPU is a 16-core G2-Ultra NX. The report said the overall specification places the chip close to flagship-class territory.

Xiaomi’s own benchmark claims

Xiaomi said its internal testing shows about a 60% gain in multi-core performance over the previous generation. It also claimed GPU graphics performance improved by as much as 85%, while energy efficiency rose 64%. Reported benchmark results were 5,228,014 on AnTuTu and 15,221 in Geekbench multi-core.

Those numbers came from Xiaomi’s own testing rather than an independent third-party benchmarking firm. Real-world battery life and user experience will need to be assessed after commercial devices ship. The first model to carry the Xring O3 will be the foldable Xiaomi 18 Fold, which is expected to launch in September 2026.

Bloomberg says Xiaomi still relies heavily on outside suppliers

Bloomberg Intelligence analysts Steven Tseng and Rebecca Wang said Xring O3 remains at 3nm while the next flagship chips from Qualcomm and MediaTek are already preparing to move to 2nm. In their view, that suggests Xiaomi is focusing its resources on architecture and feature upgrades rather than pushing process shrinkage further.

The analysts said redesigned computing units, faster memory and stronger on-device AI capability could help Xiaomi create more differentiation for its flagship phones. If the Xring family expands across more devices, it could also improve R&D efficiency by spreading design costs over a broader product lineup.

Bloomberg also noted that the chip’s reported shipment target of 200,000 to 300,000 units is small compared with the tens of millions of units Qualcomm and MediaTek ship annually. That means Xiaomi is still likely to depend heavily on those two suppliers in the near term. In that framing, the in-house chip looks more like a bargaining lever than a full replacement plan.

Pressure on Xiaomi’s broader hardware business

The report said Xiaomi was once the top smartphone vendor by market share in China, but its smartphone and electric vehicle businesses are both facing weak domestic demand. According to Counterpoint Research, Xiaomi recorded the steepest shipment decline among major hardware vendors in the quarter ending in June this year.

Investors are also concerned that aggressive pricing for Xiaomi’s newest sport utility vehicle could put more pressure on profit margins. Against that backdrop, Xring O3 is not only a product launch. The report cast it as part of Xiaomi’s effort to regain control of the narrative and strengthen its hand in supplier negotiations at a time of rising revenue pressure.

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