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Lisa Su

Intel
2026-06-20 23:00:52

Intel CEO Lip-Bu Tan Outlines a 5-to-10-Year 10x Goal Built on Advanced Packaging, Glass Substrates and Synthetic Diamond

In his first podcast interview as Intel CEO, Lip-Bu Tan laid out a broad restructuring plan for the company, spanning balance-sheet repair, product focus, foundry execution, EMIB advanced packaging, glass substrates, GaN, SiC, InP and synthetic diamond wafers. Tan said Intel has generated roughly a sixfold return for shareholders over the past 14 months and set a personal target of a 10x return over five to ten years.

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Intel CEO Lip-Bu Tan Outlines a 5-to-10-Year 10x Goal Built on Advanced Packaging, Glass Substrates and Synthetic Diamond
Intel
2026-06-20 20:00:52

Intel CEO Lip-Bu Tan Outlines a 5-to-10-Year, 10x Goal Built on Packaging, Substrates and New Materials

In his first extended podcast interview as Intel CEO, Lip-Bu Tan described a multi-year plan to rebuild Intel around a stronger balance sheet, sharper products, foundry discipline, EMIB advanced packaging, glass substrates and new semiconductor materials. He also discussed the Terafab collaboration with Elon Musk, rising CPU demand from agentic AI and inference, and his goal of pursuing a 10x return over five to ten years.

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Intel CEO Lip-Bu Tan Outlines a 5-to-10-Year, 10x Goal Built on Packaging, Substrates and New Materials
Intel
2026-06-20 18:00:52

Intel CEO Lip-Bu Tan Lays Out a 5-to-10-Year Tenfold Goal Built on Advanced Packaging, Glass Substrates and Synthetic Diamond

In his first detailed podcast interview as Intel CEO, Lip-Bu Tan said his goal is to deliver a tenfold return over five to ten years. He described a roadmap centered on XPU, foundry services, EMIB advanced packaging, glass substrates, GaN, SiC, InP and synthetic diamond, while stressing yield, defect density and cycle time as the core metrics for Intel Foundry.

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Intel CEO Lip-Bu Tan Lays Out a 5-to-10-Year Tenfold Goal Built on Advanced Packaging, Glass Substrates and Synthetic Diamond