MediaTek-linked Google TPU v9 shipment timeline may slip to Q1 2028

Google’s TPU v9 program, which involves MediaTek, is facing fresh timing questions after a reported design change to Core A. Citing institutional sources via Commercial Times, the report said the adjustment pushed development back by about three weeks, with the first tape-out now expected in January 2027 and shipments potentially moving to the first quarter of 2028. The November 2026 sample target was said to remain unchanged, while the mass-production tape-out is projected for the second quarter of 2027. The delay has also fueled debate over packaging and substrate technology. TrendForce said the chip is expected to use Intel’s EMIB-T packaging, where substrate yield remains a key factor for scale and cost competitiveness. DIGITIMES linked the schedule shift to Google’s design revision and referenced earlier yield issues during packaging, while also mentioning market talk around advanced glass substrates. That claim was challenged by Citrini analyst Zephyr, who said TPU v9 does not use glass substrates and that Broadcom, not MediaTek, would be the first to adopt them around 2029 to 2030. MediaTek is expected to face questions on the matter at its late-October earnings call.