Samsung targets 2029 start for first Yongin fab as AI demand pushes Korean chipmakers to expand

Samsung Electronics plans to move up the production start date for the first wafer fab in its Yongin semiconductor cluster in South Korea by two years, aiming to begin operations in October 2029 instead of 2031, according to BlockBeats. The South Korean government and Samsung have reached an agreement on the accelerated schedule and will speed up work on land development and core infrastructure including power and water supplies. At the same time, SK Hynix is reviewing a new production base in the United States. The report said the company has been studying options since the start of this year to establish semiconductor manufacturing capacity in the U.S., where AI industry development is concentrated. The move comes after SK Hynix successfully listed on Nasdaq on July 10. The report said major memory chip makers including Samsung Electronics and SK Hynix are expanding capacity as AI-driven demand tightens chip supply. South Korea is also pushing new semiconductor industrial parks and looking to speed up project approvals through simplified environmental reviews and optimized administrative procedures. While some in the market remain concerned about the semiconductor cycle reaching a peak, demand for chip capacity is still described as strong.