Broadcom’s Wall Street underwriting group is reportedly working on a new $60 billion financing package tied to AI chip purchases for Anthropic and other companies, according to BlockBeats, which cited people familiar with the matter. The reported debt structure includes $42 billion of Class A senior secured debt, with banks said to be preparing underwriting invitation letters. A separate $18 billion tranche of Class B junior debt is being led by Blackstone, the report said. People familiar with the plan also said multiple Blackstone funds have committed $9 billion, while the remaining portion is expected to be distributed externally. Broadcom declined to comment through a spokesperson. The report did not name the banks involved or provide a timeline beyond saying the invitations are set to be issued soon.
Broadcom’s Wall Street underwriting group is working to raise $60 billion in new financing for AI chip purchases that would benefit Anthropic and other companies, according to BlockBeats, citing people familiar with the matter.
The reported debt package includes $42 billion in Class A senior secured debt. Banks involved in the deal are said to be preparing underwriting invitation letters. People familiar with the matter also said Blackstone is leading an $18 billion Class B junior debt tranche. Multiple Blackstone funds have committed $9 billion, and the rest is planned for external distribution.
A Broadcom spokesperson declined to comment.
This article was originally published by Bit.Fan. For more cryptocurrency news and market insights, visit www.bit.fan. Disclaimer:
The market information, project data, and third-party content displayed on this platform are for industry information sharing only and do not constitute any form of investment advice or return commitment.
Cryptocurrency trading carries high risks. Users should fully assess their risk tolerance and make independent decisions. All profits, losses, and legal responsibilities are borne by the users themselves.
