Citrini analyst Jukan said on Oct. 18 that Samsung Electronics is his top pick among the three major memory makers in relation to NVHBM demand. His view rests on a capacity argument: Taiwan Semiconductor Manufacturing Co. still needs to allocate wafer capacity to Nvidia’s Rubin and Rubin Ultra, which in his view limits TSMC’s ability to take on large volumes of NVHBM orders. That leaves Samsung, with its own foundry capability, as the only company positioned to meet excess NVHBM demand if orders run beyond what TSMC can handle. The note also referenced earlier Korean media reporting that, at Nvidia’s request, Samsung had decided to use TSMC’s 3 nm process to produce base dies for NVHBM. Even so, Samsung has not fully ruled out using its own foundry lines and is still verifying whether it can manufacture those base dies internally if NVHBM demand exceeds TSMC’s available capacity.
BlockBeats reported on Oct. 18 that Citrini analyst Jukan said Samsung Electronics is his preferred name among the three major memory manufacturers.
Jukan wrote that Taiwan Semiconductor Manufacturing Co. still has to allocate wafer capacity to Nvidia’s Rubin and Rubin Ultra, making it difficult for TSMC to absorb large volumes of NVHBM orders. In that setup, Samsung, which has in-house foundry capability, is the only player able to satisfy excess NVHBM demand.
Earlier Korean media reports said that, at Nvidia’s request, Samsung had decided to use TSMC’s 3 nm process to produce NVHBM base dies. Samsung has not fully ruled out its own foundry, however, and is testing whether it can manufacture the base dies internally if NVHBM demand rises beyond TSMC’s capacity.
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