Chinese DRAM maker ChangXin Memory Technologies, or CXMT, has started equipment tendering for a new plant in Shanghai while moving ahead with capacity expansion in multiple locations, according to a ChainCatcher newsflash. The company is currently mass-producing DRAM at Hefei Phase II and Beijing Phase I, with output estimated at the mid-200,000-wafer-per-month range and possibly above 300,000 wafers per month by year-end. CXMT plans to open the Shanghai plant in the fourth quarter of this year, and industry sources said the site is expected to be expanded in two phases, with capacity set to come in well above 100,000 wafers per month. The report also said CXMT plans to open a new Hefei plant in the first half of next year, a new Beijing plant as early as the second half of next year, and another Hefei plant in the first half of the following year. If all of those projects are completed, CXMT could add at least 70,000 to 80,000 wafers per month of new capacity each year from this year through 2028, with long-term capacity potentially exceeding 600,000 wafers per month.
ChangXin Memory Technologies (CXMT), China’s largest DRAM maker, has started equipment tendering for a new plant in Shanghai and is also advancing capacity expansion across several locations, according to ChainCatcher.
CXMT is currently mass-producing DRAM at Hefei Phase II and Beijing Phase I. Its capacity is estimated at the mid-200,000 wafers per month range and could top 300,000 wafers per month by the end of the year.
The company plans to open the new Shanghai plant in the fourth quarter of this year, and related equipment bidding has already begun. Semiconductor equipment industry sources said the plant is planned for a two-stage expansion, with capacity expected to come in significantly above 100,000 wafers per month.
CXMT then plans to open a new Hefei plant in the first half of next year, a new Beijing plant as early as the second half of next year, and another new Hefei plant in the first half of the following year.
Industry sources also said CXMT has been in talks with multiple parties about the timing of plant construction in several locations. If all plans are carried out, CXMT could add at least 70,000 to 80,000 wafers per month of capacity each year from this year through 2028, with long-term capacity potentially exceeding 600,000 wafers per month.
For comparison, Samsung Electronics and SK Hynix are estimated to have DRAM capacity of about 700,000 wafers per month and 600,000 wafers per month, respectively.
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