Intel CEO Chen Liwu recently published an article titled "The Second Half of the Computing Power Battle: How AI Reshapes the Global Semiconductor Supply Chain," focusing on the profound impact of artificial intelligence on the semiconductor industry chain. The article examines how AI technology is driving supply chain changes across chip design, manufacturing, and packaging, declaring a new era in the global computing power race.
With the rapid development of generative AI and large language models, demand for high-performance computing chips has surged exponentially, prompting chip manufacturers to accelerate technology iterations. Advanced process nodes, chiplet architectures, and heterogeneous integration have become focal points in the industry. As a traditional semiconductor leader, Intel is undergoing a strategic transformation through its IDM 2.0 initiative, ramping up investments in AI accelerators and advanced packaging.
Meanwhile, geopolitical factors are intensifying in the global semiconductor supply chain, with many countries promoting localized production. Chen Liwu's article offers valuable insights from a corporate perspective on the reshaping of the supply chain.
