Jentech (3653), a maker of thermal components, reported self-filed financial results for August of year 115, with consolidated revenue of NT$3.226 billion, up 91% from a year earlier. Net profit attributable to the parent reached NT$1.079 billion, up 101%, and earnings per share came in at NT$7.35, up 95%.
The company also said pretax profit for the month was NT$1.356 billion, up 100% year over year, with a pretax margin of 42%. The figures showed profit expanding faster than revenue as monthly sales nearly doubled.
Second-quarter EPS reached NT$15.80, trailing four-quarter EPS hit NT$44.64
According to CPA-reviewed financial statements for year 115 Q2, Jentech posted quarterly revenue of NT$7.275 billion, up 40% from a year earlier. Net profit attributable to the parent was NT$2.318 billion, while quarterly EPS reached NT$15.80, up 101%.
For the four quarters from year 114 Q3 through year 115 Q2, cumulative consolidated revenue totaled NT$22.922 billion and cumulative EPS reached NT$44.64. The source article said this reflected sustained shipments of high-end server thermal components at elevated levels.
Shares climbed to a record NT$7,160 on Sept. 29
Jentech shares rose against the broader trend and hit a record NT$7,160 on Sept. 29. Market analysis cited in the source said the latest revenue and profit growth was mainly driven by demand for high-end vapor chambers tied to high-performance computing, or HPC, and AI chips.
TSMC adds microchannel cooling to advanced packaging planning
TSMC said at a recent forum that as chip thermal design power, or TDP, continues to rise, conventional external heat-conduction structures are approaching physical limits. Its R&D team has therefore added microchannel technology to its advanced packaging plans.
The structure uses micron-scale channels inside the chip structure to guide coolant and enable direct liquid cooling. According to the source, that can significantly reduce thermal resistance and push the supply chain to accelerate upgrades in micron-level precision processing.
Jentech advances MC Lid and hybrid module development
As advanced packaging and kilowatt-class chips reshape cooling requirements, Jentech is using stamping and forging processes to develop Microchannel Lid, or MC Lid, products as well as hybrid modules that combine them with vapor chambers, or VC.
The source article said the design helps shorten the thermal resistance path between the die and the cooling medium, extending the company’s products from traditional vapor chambers to chip package-level thermal management structures. It added that the actual contribution still depends on later mass-production progress.