Nanya Technology said at its investor conference on Oct. 12 that it had released its self-calculated consolidated financial report for the third quarter of 2026, with results lifted by a capacity crowding-out effect among major international memory manufacturers and a sharp rise in DDR4 prices as supply stayed tight.
Third-quarter consolidated revenue reached TWD 133.649 billion. Gross margin rose to 85.7%, while net profit after tax hit TWD 87.627 billion. Earnings per share came in at TWD 25.40, and the company said all three figures set record highs. It also announced that revenue from AI infrastructure-related business has officially surpassed 20% of the total and unveiled a large-scale capital expenditure plan.
Revenue and profit reached record highs in the third quarter
Nanya Technology reported third-quarter consolidated revenue of TWD 133.649 billion, up 61.9% from the previous quarter. The company said the increase was mainly driven by a significant rise in DRAM average selling prices.
Gross profit for the quarter was TWD 114.482 billion, with a gross margin of 85.7%. Operating income reached TWD 106.894 billion, and operating margin was 80.0%. Net profit after tax totaled TWD 87.627 billion, while quarterly earnings per share were TWD 25.40.
For the first three quarters combined, net profit after tax reached TWD 163.877 billion, and earnings per share were TWD 49.28.
AI infrastructure revenue moved above 20%
Nanya Technology said it has been adjusting its product mix in response to demand related to artificial intelligence. Revenue from AI infrastructure segments including servers, networking, storage and system management has now officially exceeded 20% of total revenue.
The company said it continues to work with customers on customized AI products and Wafer-on-Wafer products.
To meet long-term market demand, Nanya set an upper limit of TWD 69.7 billion for 2026 capital expenditures. For the first phase of its 5A new fab, the company plans monthly capacity of 39,000 wafers. Total capital spending from 2026 to 2029 is projected at TWD 346.6 billion, and equipment installation is expected to begin in the first quarter of 2027.
Advanced process roadmap and Pingtung packaging plan
On technology development and manufacturing deployment, Nanya said it is continuing to advance multiple process generations and advanced packaging and testing technologies. Its third-generation 10nm-class 1C process is expected to begin customer validation in the first quarter of 2027. Development of the fourth-generation 1D process, fifth-generation 1E process, and extreme ultraviolet lithography, or EUV, is also progressing on schedule.
The company also plans to build a 3D wafer packaging and testing plant in Pingtung Science Park. It expects to introduce through-silicon via, or TSV, and wafer stacking technologies for advanced 3D IC production by the end of 2028.
Its product lineup continues to cover specifications including DDR5 and LPDDR5/5X.
