Samsung Electro-Mechanics said on Oct. 19 that it signed a supply contract for packaging substrates used in memory semiconductors with a global major company, according to THE ELEC. The contract is worth KRW 360.5 billion and runs from Jan. 1 to Dec. 31, 2027, equal to 3.2% of the company’s consolidated revenue from last year. It marks the first time Samsung Electro-Mechanics has disclosed a long-term supply contract tied to packaging substrates. Including this agreement, the company has disclosed seven long-term supply contracts this year with a combined value of about KRW 4.3 trillion. Earlier contracts were mainly tied to component businesses such as silicon capacitors, multilayer ceramic capacitors, and inductors, while this one extends to its package solution business, which makes products including FC-BGA and BGA substrates. The company also said last month it would invest KRW 4.27 trillion in Sejong FC-BGA production facilities and KRW 2.51 trillion in packaging substrate equipment in Vietnam. As part of a large government project, it plans to invest KRW 8 trillion in its Sejong site and KRW 15 trillion in its Busan site by 2040, while producing FC-BGA in Busan, Sejong, and Vietnam.
Samsung Electro-Mechanics said on Oct. 19 that it had signed a supply contract with a global major company for packaging substrates used in memory semiconductors, according to THE ELEC. The deal is valued at KRW 360.5 billion.
The contract runs from Jan. 1 to Dec. 31, 2027, and is equivalent to 3.2% of the company’s consolidated revenue from last year. It is the first time Samsung Electro-Mechanics has disclosed a long-term supply contract for packaging substrates.
With this agreement included, the number of long-term supply contracts disclosed by the company this year has risen to seven, with a combined value of about KRW 4.3 trillion. Previous contracts were mainly concentrated in component businesses such as silicon capacitors, multilayer ceramic capacitors, and inductors. This time, the scope expanded to the package solution business, which produces FC-BGA substrates and BGA substrates.
Last month, Samsung Electro-Mechanics also announced plans to invest KRW 4.27 trillion in FC-BGA production facilities in Sejong and KRW 2.51 trillion in packaging substrate production equipment in Vietnam.
The company also said that, as part of a large government project, it plans to invest KRW 8 trillion in its Sejong site and KRW 15 trillion in its Busan site by 2040, and produce FC-BGA in Busan, Sejong, and Vietnam.
A company official said, 「Growth in the AI and high-performance computing markets is making high-performance packaging substrates more important, and the company will strengthen supply cooperation with customers and build a stable supply system.」
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