Samsung weighs 4 nm foundry expansion as HBM4 base chip demand rises

Samsung weighs 4 nm foundry expansion as HBM4 base chip demand rises

N
News Editor
2026-09-22 06:50:51
Samsung Electronics is reviewing an expansion of its 4 nm foundry capacity as demand for HBM4 base chips increases, according to a Sept. 21 report by Money Today cited by ChainCatcher. The company is pushing ahead with advanced-process capacity growth as the HBM market expands. Samsung’s HBM4 combines a 10 nm-class sixth-generation (1c) DRAM core die with a 4 nm logic base die that handles high-speed data exchange with GPUs and other AI accelerators. Unlike SK hynix, which uses TSMC’s 12 nm process for its HBM4 base chip, Samsung is using its own 4 nm node. The report said Samsung’s relevant production line is already running at full capacity and has taken orders tied to Nvidia Groq 3 LPUs. Samsung has also recently raised prices for new 4 nm orders and HBM4 base chips. The company expects third-quarter HBM4 revenue to rise by more than three times from the previous quarter, with HBM4 accounting for well above 60% of HBM revenue in the second half. It is also evaluating a new 2 nm line for HBM5.

Samsung Electronics is reviewing an expansion of its 4 nm foundry capacity as rising demand for HBM4 base chips adds pressure to advanced-process production, according to a Sept. 21 report by Money Today cited by ChainCatcher.

HBM4 design centers on 1c DRAM and a 4 nm logic base die

The report said Samsung’s HBM4 consists of a 10 nm-class sixth-generation, or 1c, DRAM core die and a 4 nm logic base die. The base die is responsible for high-speed data exchange with GPUs and other AI accelerators.

Samsung is taking a different route from SK hynix, which uses TSMC’s 12 nm process for its HBM4 base chip. Samsung is instead using its own 4 nm process for that component.

4 nm lines are fully loaded

Samsung’s related production line is already running at full capacity and has secured orders tied to Nvidia Groq 3 LPUs, the report said. The company has also recently raised prices for new 4 nm orders and for HBM4 base chips.

Samsung expects third-quarter HBM4 revenue to increase by more than three times from the previous quarter. In the second half, HBM4 is expected to account for well above 60% of total HBM revenue.

Pyeongtaek P4 expansion and next-step plans

Most of the additional expansion at Pyeongtaek P4 will be used for 1c DRAM for HBM. More than half of Samsung’s 4 nm foundry capacity has already been allocated to HBM4 base chips.

HBM4E will also use a 4 nm base chip, and Samsung provided samples to customers in May.

The company is also evaluating a new 2 nm production line for HBM5. Its target is to use a 2 nm process based on gate-all-around, or GAA, architecture and increase TSV density, lifting operating speed by more than 50% compared with HBM4E.

Samsung started first-generation 2 nm mass production in the second half of last year and is advancing second-generation products in the second half of this year.

Citi projects a supply gap next year

Citi expects global HBM bit demand to reach 75.2 billion Gb next year, up 62% year over year, while supply is projected at about 59.4 billion Gb. That implies a gap of about 21%.

This article was originally published by Bit.Fan. For more cryptocurrency news and market insights, visit www.bit.fan.
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