SK Hynix is bringing advanced packaging technologies into its next-generation high-bandwidth memory, or HBM, roadmap, including Intel’s Embedded Multi-die Interconnect Bridge, better known as EMIB. The company also said it ultimately plans to move into the 3D packaging era as it pushes its memory stack design further.
At the 2026 Hot Chips conference, Jaesik Lee, vice president of package engineering at SK Hynix, presented a session titled "Advanced Packaging for High-Bandwidth Memory." In that presentation, he detailed how the company intends to use packaging advances to speed up its HBM product roadmap.
SK Hynix is currently exploring methods such as hybrid bonding to break past the 16-layer stacking limit. Looking ahead, the company also plans to address power consumption challenges by increasing the number of through-silicon vias, improving IO speed for logic process integration, and optimizing the power delivery network, or PDN. As of publication, SK Hynix shares in South Korea were up 1.71%.
SK Hynix is bringing advanced packaging tech into its next-gen high-bandwidth memory, or HBM, and that includes Intel’s EMIB. The company says it will eventually push into 3D packaging.
At the 2026 Hot Chips conference, Jaesik Lee, vice president of package engineering at SK Hynix, gave a talk called "Advanced Packaging for High-Bandwidth Memory." He laid out how the company wants to use advanced packaging to speed up its HBM product roadmap.
Right now, SK Hynix is testing ideas like hybrid bonding to get past the 16-layer stacking limit. Power is another headache. So the company plans to raise the number of TSVs, boost IO speed for logic process integration, and tune the power delivery network, or PDN. At the time of publication, SK Hynix shares in South Korea were up 1.71%.
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