Israeli chipmaker Xsight Labs has closed a $300 million funding round, valuing the company at between $2.5 billion and $2.8 billion post-money. The round was led by Fidelity Investments and Atreides Management, with founder Avigdor Willenz also taking part. Xsight Labs develops its X series switching chips and E series DPUs for high-efficiency networking in AI data centers. According to CryptoBriefing, the company’s chips have already been adopted for Starlink’s next-generation V3 satellite project. Xsight Labs is also aiming to win a share of the AI data center networking market, which it said could reach $150 billion by 2028.

Advanced Micro Devices is no longer being framed as the low-cost alternative in AI infrastructure. Citing a new report from research firm Futurum, Wccftech said AMD’s Helios AI rack is expected to sell for $5 million to $5.5 million per rack, compared with an estimated $3.5 million to $4 million for Nvidia’s second-generation Vera Rubin rack. That puts Helios roughly 40% higher on price, though the figure is based on bill-of-materials analysis rather than an official AMD quote. Helios is AMD’s first rack-scale, full-stack system built for AI workloads. It combines the Instinct MI455X GPU, sixth-generation EPYC Venice CPUs, Pensando Vulcano 800 AI NICs, Salina DPUs, Infinity Fabric interconnect and the ROCm software platform in one architecture. On specs, Nvidia’s Vera Rubin leads in FP4 compute and HBM4 bandwidth, while AMD leads in FP8 compute and memory capacity, with 432 GB of HBM4 versus Rubin’s 288 GB. Microsoft has confirmed it will deploy Helios in Azure AI services. OpenAI, Meta, Oracle, Celestica, Nutanix and the U.S. Department of Energy were also listed as customers, giving AMD an early roster across cloud, enterprise IT and government.

Shenzhen-based Yunbao Smart has had its application for a ChiNext IPO accepted by the Shenzhen Stock Exchange, putting the chip startup on track to pursue the label of China’s first listed DPU company. Founded in August 2020 by Stanford PhD Xiao Qiyang, the company focuses on data processing units, a segment that gained attention after Nvidia introduced the DPU concept and Jensen Huang outlined the “CPU+DPU+GPU” architecture. According to the prospectus cited in the report, Yunbao Smart developed what it describes as China’s first high-performance, general-purpose programmable DPU SoC chip, with network bandwidth of 400 Gbps, four times the performance of traditional solutions, and power consumption cut by more than 50%. The company said it moved from FPGA verification to 6nm SoC mass production in four years. Financially, revenue rose from RMB 170,000 in 2023 to RMB 36.35 million in 2024 and RMB 370 million in 2025, while net losses were RMB 667 million, RMB 600 million, and RMB 1.19 billion over the same period. Tencent, which first invested in the angel round and kept backing later financings, held 19.7792% before the IPO through affiliated entities, making it Yunbao Smart’s largest shareholder. The report said the company’s valuation exceeded RMB 14 billion after a funding round in late November 2025.