Lam Research

Lam Research posts record $8.22 billion quarter as China revenue share rebounds to 35%
Bernstein keeps Outperform on Lam Research after earnings beat, says 2027 WFE outlook is capped by cleanroom limits
Meta capex hits $34.91 billion as DeepSeek is reportedly raising $15 billion
advanced pack
2026-10-19 03:09:11

ASML, Applied Materials and Lam Research Push Deeper Into Advanced Packaging as Besi Faces Pressure

Advanced packaging is turning into a new battleground for semiconductor equipment makers, and the pressure is already showing up in the market. In early October, Bank of America cut its rating on Dutch packaging equipment supplier Besi, citing concerns that ASML could enter the hybrid bonding equipment market and that demand for HBM-related tools may be delayed. Besi shares fell 5.39% on Oct. 6 and another 8.49% the next day after UBS also downgraded the stock, leaving the company down about 13.4% over two trading sessions. At the same time, Applied Materials and Lam Research are expanding their positions through different routes. Applied Materials widened its work with Besi and Intel in the first week of October, covering hybrid bonding, thermocompression bonding, chip-to-panel integration and Intel’s Foveros 3D packaging. Lam Research is building out its presence in TSV and 3D interconnect equipment through etch, deposition and copper plating. ASML, for its part, has already delivered its TWINSCAN XT:260 system for advanced packaging and has been reported to be developing hybrid bonding equipment. The result is a shift in an industry that once had a clearer split between front-end and back-end tools. As packaging moves closer to wafer-level precision and materials engineering, the contest is no longer limited to traditional packaging specialists.

340
ASML, Applied Materials and Lam Research Push Deeper Into Advanced Packaging as Besi Faces Pressure
Lam Research begins work on AI semiconductor R&D lab in Oregon
Lam Research rises 6.58% after hours as earnings and outlook beat estimates
Bernstein says chip equipment stocks may hold up even if memory pulls back