Research note says China’s memory push is now split across CXMT, YMTC and XMC
A research note from Schulz_Research said China’s memory buildout is no longer centered on a single company, but on a three-part structure led by CXMT, YMTC and XMC. In the note, CXMT is described as handling DRAM wafers, while YMTC focuses on NAND and is adding DRAM at its newest plant. XMC, a foundry controlled by YMTC, is tasked with stacking products from both lines. The post linked that structure to rules Beijing has applied since late December last year. Under those rules, newly approved factories must show in procurement tenders that at least half of their equipment is sourced domestically, with exemptions granted only when no domestic option is available. Schulz_Research said YMTC’s Wuhan Phase 3 is the first advanced memory project cleared under that framework and is set to begin production later this year. The note also outlined capacity figures for CXMT, YMTC and XMC, alongside market-share estimates and product updates including DDR5, LPDDR5 and planned HBM3 production.




