Chinese memory maker ChangXin Memory Technologies, or CXMT, has started small-batch production of HBM3E and plans to expand output in 2027, according to The Information, which cited two people familiar with the matter. The report said domestic chip teams including Cambricon and Alibaba’s T-Head have already been testing CXMT’s HBM products, and if those efforts go smoothly, the memory could appear in products as early as next year. HBM, or high-bandwidth memory, sits alongside AI chips and feeds them data at high speed, making it a critical component for AI computing. The report described HBM2 and later generations as a longstanding weakness for China’s domestic AI chip supply chain. In product-generation terms, CXMT is one step behind SK Hynix, Samsung and Micron, which are already mass-producing HBM4. Still, the report said small-batch production is not the same as mature mass production. CXMT’s HBM3E currently has lower yields, and its speed and reliability trail the three established suppliers. SK Hynix began mass production of HBM3E in 2024, and the three leading makers have already moved into HBM4 and started sampling HBM4E.
ChangXin Memory Technologies has begun small-batch production of HBM3E and plans to expand output in 2027, according to The Information, which cited two people familiar with the matter.
HBM, short for high-bandwidth memory, is the high-speed memory placed next to AI chips to feed them data quickly. The report said HBM2 and newer products have remained a key gap for China’s domestic AI chip efforts.
Domestic chip teams including Cambricon and Alibaba’s T-Head have already been testing CXMT’s HBM, the report said. If progress stays on track, the memory could be used in products as early as next year.
HBM3E is also the generation used in Nvidia’s H200 and Blackwell. By product generation, CXMT is now only one step behind SK Hynix, Samsung and Micron, which are already mass-producing HBM4.
Still, small-batch production remains some distance from mature mass production. The report said CXMT’s HBM3E still has relatively low yields, while its speed and reliability also lag the three major suppliers.
SK Hynix started mass production of HBM3E as early as 2024. The three leading manufacturers have now moved into HBM4 and have begun sampling HBM4E.
For CXMT, the latest step clears the question of whether it can make the product at all. The next challenge is to raise yields and output.
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