ChainCatcher reported that Xiaomi founder Lei Jun said the company’s new Xring family chips — Xring O3, Xring O100 and Xring D100 — have all completed tape-out validation.
Xring O3 to debut in Xiaomi 18 Fold
Lei said Xring O3 is an AI flagship SoC aimed at Xiaomi’s highest-end products and will make its first appearance in the Xiaomi 18 Fold. Xring O100 is a high-bandwidth AI accelerator with 1.22 TB/s of bandwidth, while Xring D100 was described as China’s first 3nm high-compute AI chip for smart driving. Xiaomi said the latter two chips will enter formal commercial use next year.
According to the company, the three chips are designed to cover edge-side AI computing demand across Xiaomi’s phone, vehicle and home ecosystem.
Xring O3 specifications
Xring O3 is built on a 3nm process, with a die area of 133 mm² and 24 billion transistors. Xiaomi said this marks a 26% improvement over the previous generation, and listed an AnTuTu extreme benchmark score of 5.22 million.
On the CPU side, the chip uses a 10-core all-big-core design and reaches a top clock speed of 4.35 GHz. Xiaomi listed Geekbench scores of 3,945 in single-core and above 15,000 in multi-core tests. The GPU has 16 cores and supports ray tracing. The company said several graphics metrics improved sharply from the previous generation while power consumption fell by 64%.
Xiaomi also said O3 is the first in the industry to support LPDDR6. Its NPU Tensor compute reaches 200 TOPS, and the chip includes dedicated optimization for large language model inference.
Xring O100 and D100 positioning
Xring O100 was described as the world’s first 6nm 3D wafer-level stacked AI accelerator. It uses Wafer on Wafer packaging and hybrid bonding, stacking two layers of AI-dedicated high-speed DRAM with one layer of high-performance NPU vertically to deliver 1.22 TB/s bandwidth.
Xiaomi said that when O100 works together with O3, local AI inference speed can reach as high as 330 Tokens/s.
Xring D100 was described by the company as China’s first 3nm high-compute AI chip for smart driving.
More than five years of renewed chip development
Lei also said Xiaomi has spent more than five years after restarting large-chip research and development, with cumulative investment exceeding RMB 21 billion and a chip team of nearly 3,000 people.