Intel CEO Lip-Bu Tan and Broadcom CEO Hock Tan have warned that access to capital may become the biggest constraint on the AI boom, even as demand for computing infrastructure continues to outstrip supply, according to Techub, citing CNBC. Speaking at a conference in Singapore, Hock Tan said financing could prove a bigger obstacle than shortages of semiconductors, memory chips, or power. Lip-Bu Tan said the industry is facing pressure from both capital availability and the cost of capital, adding that long-term returns will be critical. Their comments point to funding conditions, rather than hardware demand alone, as a central issue for AI-related investment.
Access to capital could become the biggest bottleneck for the AI boom, Intel CEO Lip-Bu Tan and Broadcom CEO Hock Tan warned, according to Techub, citing CNBC, even though demand for computing infrastructure still exceeds supply.
Speaking at a conference in Singapore, Hock Tan said financing may become a bigger obstacle than shortages of semiconductors, memory chips, or power.
Lip-Bu Tan said the industry is under pressure from both capital availability and the cost of capital, with long-term returns remaining the key issue.
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