SK hynix said at FMS 2026 that it has jointly released the first High Bandwidth Flash, or HBF, standard specification with Sandisk, roughly six months after the two companies formed the alliance in February this year. The specification has been disclosed through the Open Compute Project and sets out key parameters including capacities of up to 512GB, three bandwidth tiers topping out at about 3.0TB/s, and use of the UCIe interconnect interface. Google and Tenstorrent have confirmed they are joining the HBF alliance. The technology is positioned as a new storage tier between high-bandwidth memory and SSDs, combining HBM-class transfer speeds with NAND’s larger capacity scaling. During the event, SK hynix also publicly showed its 10th-generation V10 375-layer 4D NAND wafer and related product for the first time, saying energy efficiency is 2.5 times better than the previous generation and that mass production is expected early next year. In a conference presentation, an SK hynix executive also outlined a tiered memory architecture as a way to address data-processing demands in the AI inference era.
SK hynix announced at FMS 2026 that it has jointly released the first High Bandwidth Flash, or HBF, standard specification with Sandisk, about six months after the two companies formed the alliance in February this year.
Specification released through OCP
The HBF standard has been disclosed through the Open Compute Project, covering key specifications including capacities of up to 512GB, three bandwidth tiers with the top level reaching about 3.0TB/s, and adoption of the UCIe interconnect interface.
Google and Tenstorrent have confirmed they are joining the HBF alliance.
A new tier between HBM and SSDs
HBF is positioned as a new storage layer between HBM and SSDs, combining HBM-class high-speed transfer with the large-capacity expansion capability of NAND.
10th-generation 4D NAND shown for the first time
During the event, SK hynix also publicly displayed its 10th-generation V10 375-layer 4D NAND wafer and product for the first time. The company said the new generation delivers 2.5 times better energy efficiency than its predecessor and is expected to enter mass production early next year.
Tiered memory proposed for AI inference workloads
In a presentation at the conference, an SK hynix executive proposed a tiered memory architecture to address data-processing challenges in the AI inference era.
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