MOU

Policy Regula
2026-07-27 07:27:47

Six Silicon Valley VCs sign strategic investment MOU with South Korea’s NPS

Six major Silicon Valley venture capital firms — Sequoia Capital, Andreessen Horowitz (a16z), Khosla Ventures, Lightspeed Venture Partners, General Catalyst and New Enterprise Associates (NEA) — have signed a strategic investment memorandum of understanding with South Korea’s National Pension Service (NPS), according to Korean outlet Asiae cited by ChainCatcher. The parties plan to jointly identify investment opportunities, share investment information and strengthen their global venture capital footprint. The development comes as the South Korean government steps up policies aimed at attracting overseas venture capital. A 200 trillion won “National Growth Fund” has also been launched, adding to expectations that policy funds, private capital and foreign capital could flow into the country’s venture market at the same time. Market participants expect strategic sectors such as AI and semiconductors to attract more investment. Still, investment banking industry figures cautioned that if a large amount of capital is funneled into a small number of popular companies, valuations could be pushed higher and create bubbles, potentially leading to valuation corrections at IPO or M&A exit and weighing on fund returns.

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Six Silicon Valley VCs sign strategic investment MOU with South Korea’s NPS
Samsung Elect
2026-07-26 03:47:18

Samsung signs $200 billion five-year MOU with Broadcom covering sub-2nm foundry and HBM4

Samsung Electronics said it has signed a five-year memorandum of understanding with Broadcom worth more than $200 billion, with the agreement running through 2030. The deal covers two major areas: memory supply and foundry manufacturing. Under the arrangement, Samsung will provide HBM4 and HBM4E for Broadcom’s next-generation AI accelerators, while also manufacturing Broadcom-designed ASICs on a process below 2 nanometers. The cooperation also extends to advanced packaging, including 2.3D and 2.5D integration. The report places the agreement in a broader industry and political setting. It says Broadcom may be seeking a second supplier rather than relying solely on Taiwan Semiconductor Manufacturing Co. as AI chip demand grows. The article also notes that Samsung’s 2nm mass-production yield has reportedly stayed around 50% to 60%, while TSMC’s comparable 2nm yield is said to be above 70%. That gap means the headline figure in the MOU does not automatically translate into shipment volume. The agreement was announced after a July 24 signing in San Francisco during an AI summit attended by South Korean President Lee Jae-myung and executives including Jensen Huang, Sam Altman, Dario Amodei and Hock Tan.

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Samsung signs $200 billion five-year MOU with Broadcom covering sub-2nm foundry and HBM4
SEC
2026-07-23 13:00:16

SEC and CFTC Sign MOU to Coordinate U.S. Crypto Regulation

The SEC and CFTC have signed a new MOU to coordinate crypto oversight in the U.S., covering token classification, platform supervision, and data sharing as regulators seek clearer rules for digital asset markets.

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SEC and CFTC Sign MOU to Coordinate U.S. Crypto Regulation