Capacity Expansion Plan
Micron Technology aims to double its high-bandwidth memory (HBM) production capacity by the end of 2026, adding up to 60,000 wafers per month, according to a report from ET News on September 3. Sources said the company's HBM output was around 40,000-50,000 wafers per month last year, and it expects to reach roughly 100,000 wafers by year-end, narrowing the gap with Samsung Electronics and SK Hynix. Micron is increasing purchase orders with multiple HBM equipment suppliers, with production lines mainly at its fabs in Taiwan and Singapore.
Product Mix Shift to HBM4
Currently, Micron's HBM output is dominated by HBM3E 12-layer products. At the beginning of this year, HBM4 12-layer accounted for 20% to 30% of the mix, a share that could rise to 50% by year-end. HBM4 12-layer is designed for Nvidia's latest AI accelerator, Vera Rubin, and Micron started mass production in the second quarter. CEO Sanjay Mehrotra said at the company's fiscal Q3 2026 earnings call in June that the ramp of HBM4 12-layer is about twice as fast as that of HBM3E 12-layer, and cumulative revenue from HBM4 shipments has already exceeded $1 billion.
Competitive Landscape
Industry estimates put Samsung's and SK Hynix's respective HBM capacity at 150,000-200,000 wafers per month. According to Counterpoint data, in the second quarter, SK Hynix held a 50% global HBM market share, Samsung 32%, and Micron only 18%. To further close the gap, Micron is also preparing investments in Hiroshima, Japan.