DUV

China semicon
2026-09-02 01:16:44

UBS: China's Chipmaking Capacity May Not Replace ASML's EUV in a Decade

UBS analysts predict that over the next decade, China's semiconductor manufacturing capacity may not progress fast enough to develop a viable alternative to ASML's cutting-edge EUV lithography technology. The report notes China's current technological maturity is roughly equivalent to ASML's level in 2004, based on patent activity. However, UBS expects China to achieve mass production of immersion DUV lithography machines within two to five years. Export restrictions prevent ASML from selling EUV equipment to China, and the analysts cite yield, capacity gaps, and regulatory hurdles limiting China's lithography equipment from being used abroad.

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UBS: China's Chipmaking Capacity May Not Replace ASML's EUV in a Decade
AMEC
2026-08-31 12:11:14

AMEC’s rise in etching tools puts China chip equipment makers under a brighter global spotlight

A long-form report carried by MarsBit and credited to WeChat account HSTL8888 traces how Advanced Micro-Fabrication Equipment Inc. China, or AMEC, moved from a startup backed by local government funding in Shanghai to a supplier validated by Taiwan Semiconductor Manufacturing Co. The piece opens with a Reuters report from early August saying Samsung Electronics and SK Hynix were evaluating AMEC chipmaking tools for use in their fabs in China, and that testing of the company’s etching tools may have started about two years ago. Samsung later denied it had ever considered the move, while SK Hynix declined to comment. The report then broadens into a history of China’s semiconductor equipment industry, covering AMEC, Piotech-related deposition efforts, Hwatsing for CMP, Skyverse for wafer inspection, ACM Research Shanghai for cleaning tools, and NAURA as a platform-style equipment company built through acquisitions. It argues that tightening U.S. export controls, support from domestic fabs such as Semiconductor Manufacturing International Corp. and funding through the National Integrated Circuit Industry Investment Fund together accelerated localization. Citing industry and official figures, the article says China’s overall localization rate in semiconductor equipment rose from under 5% to about 20% by 2025, while major foundries kept capacity utilization above 90% in the first seven months of this year.

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AMEC’s rise in etching tools puts China chip equipment makers under a brighter global spotlight
Bernstein
2026-08-13 02:02:49

Bernstein lifts WFE outlook through 2028, with DRAM and logic spending driving a 75% two-year rise

Bernstein has raised its global wafer fab equipment, or WFE, spending forecasts for 2026 through 2028 and says the current upcycle in chip equipment spending still has room to run. The firm now expects WFE to reach $148 billion in 2026, $204 billion in 2027, and $259 billion in 2028, up from prior estimates of $141 billion, $175 billion, and $198 billion. That implies cumulative growth of 75% over two years. The upgrade spans most applications and regions, but Bernstein said the larger contribution comes from memory outside China and from foundry and logic spending in China. DRAM and NAND are expected to post the fastest growth, outpacing logic and foundry. For 2027, Bernstein forecasts DRAM WFE at $69 billion, NAND at $20 billion, and logic/foundry at $104 billion, each above its earlier projections. The report also points to stronger-than-expected resilience in China. Bernstein forecasts China WFE demand at $57 billion in 2026, $57.3 billion in 2027, and $101 billion in 2028, with a sharp step-up tied to broad capacity expansion across memory, advanced logic, and mature logic. It also said recent pullbacks in semiconductor equipment stocks have created more attractive entry points, while warning that the views, ratings, and price targets cited are those of Bernstein analysts and do not constitute investment advice.

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Bernstein lifts WFE outlook through 2028, with DRAM and logic spending driving a 75% two-year rise
Elon Musk
2026-08-12 12:25:08

Musk’s TeraFab fuels new scrutiny of FEL as a possible lithography challenger

Elon Musk’s TeraFab chip manufacturing plan has moved from a compute-supply story into a lithography debate after speculation that the project may be aligned with a free-electron laser, or FEL, approach to extreme ultraviolet light sources. The discussion gained momentum after Musk posted 「FEL FTW」 on social media, a remark that many read as support for the idea. The core issue is whether FEL can attack one of the most entrenched positions in the semiconductor equipment business: ASML’s dominance in EUV lithography. The article lays out why that question is drawing attention now. ASML’s laser-produced plasma, or LPP, light source enabled commercial EUV, but its limits are becoming more visible as the industry pushes toward 2 nm and below. Conversion efficiency remains low, tin debris contaminates costly mirrors, and power requirements keep rising. FEL backers argue their approach avoids plasma conversion, removes tin-droplet contamination, and could deliver much higher EUV output. xLight, which raised an oversubscribed $40 million Series B in July last year and later brought in former Intel CEO Pat Gelsinger as executive chairman, says its system could sharply raise fab productivity. Even so, the broader field remains mixed. ASML is still expanding EUV and DUV output, advancing High-NA EUV, and posting rising sales and profit. At the same time, alternative paths including X-ray lithography, nanoimprint lithography, and electron-beam direct write are also developing, each with different trade-offs in cost, throughput, and manufacturability.

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Musk’s TeraFab fuels new scrutiny of FEL as a possible lithography challenger
Gavin Baker
2026-08-06 04:03:34

Gavin Baker says July’s AI selloff broke from the data, with Nvidia at its lowest forward multiple in a decade

Gavin Baker, founder and chief investment officer of Atreides Management, argued on Invest Like The Best that July’s selloff in AI stocks diverged sharply from industry fundamentals. He said GPU availability, GPU rental pricing, DRAM spot pricing, and token growth were all still accelerating even as many AI names fell 40% to 60% from their highs. Baker said Nvidia is now trading at its lowest forward price-to-earnings multiple of the past decade, which he sees as a sign that public markets are heavily discounting AI earnings. He also said investors misread Meta’s move to rent out compute, overstated the threat from open-source models, and treated widening CDS spreads as a credit alarm when banks may simply have been hedging commitments. At the same time, he identified regulation as the clearest downside risk, discussed long-term memory supply agreements, described Nvidia’s evolving financing model as a form of credit enhancement with revenue sharing, and pointed to SpaceX and orbital computing as underappreciated parts of the broader AI infrastructure buildout.

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Gavin Baker says July’s AI selloff broke from the data, with Nvidia at its lowest forward multiple in a decade
JZL Capital
2026-08-03 12:30:56

JZL Capital weekly: Fed split widens as ETF outflows keep pressure on BTC

JZL Capital’s weekly note for July 27 to Aug. 2 said markets were driven by a more divided Federal Reserve, softer headline inflation led by energy prices, widening dispersion across Chinese and U.S. equities, and renewed pressure on Bitcoin from spot ETF outflows. The July Federal Open Market Committee kept the federal funds rate at 3.50% to 3.75% by a 9-3 vote, with three officials explicitly backing a 25 basis point hike, which the report described as a hawkish pause rather than a neutral hold. In the U.S., June PCE slowed to 3.7% year over year from 4.1%, while core PCE eased only to 3.3% from 3.4%, suggesting headline disinflation came mainly from energy instead of a broad cooling in core pressures. In equities, the report said investors increasingly rewarded cloud revenue growth, earnings delivery and free cash flow, pointing to Microsoft’s 21.75% weekly rise and Azure’s 43% growth. In crypto, BTC fell from $65,400 to around $63,114 during the week, while U.S. spot BTC ETFs posted about $61.5 million in net outflows, reinforcing a market structure that JZL said is now constrained more by weak spot demand and internal selling pressure than by macro risk alone.

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JZL Capital weekly: Fed split widens as ETF outflows keep pressure on BTC
Policy Regula
2026-07-31 13:05:40

US Premarket Roundup: Burry Adds to Chip Shorts, Samsung Executive Buys More Shares

A heavy batch of premarket developments hit global markets on July 31, spanning chip shorts, Big Tech earnings, Bitcoin-related losses, and Korean regulatory changes. Michael Burry added to bearish positions tied to Micron, Nvidia, and the semiconductor ETF SOXX. A Wall Street Journal report said Tesla advisers had discussed a plan to separate the company’s China business, though Tesla China called the claim false. Leopold Aschenbrenner’s hedge fund Situational Awareness posted a roughly 67% drop in net asset value during July’s AI stock sell-off and sold most of its equity holdings to meet margin calls, with Citadel taking over a sizable portion. Amazon’s cloud revenue rose 37% year over year to $42.2 billion, beating expectations and lifting the stock more than 10% in premarket trading, while Apple topped revenue forecasts but fell more than 8% after issuing weaker-than-expected guidance tied to memory shortages and softer-than-expected China and services revenue. Strategy reported an $8.2 billion second-quarter loss driven by unrealized losses on its Bitcoin holdings. In South Korea, Samsung executive Roh Tae-moon bought about 700 million won of company stock, Doosan agreed to buy SK’s 70.6% stake in SK Siltron for 2.3 trillion won, and single-stock leveraged ETF turnover dropped 75.3% on the first day of new restrictions.

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US Premarket Roundup: Burry Adds to Chip Shorts, Samsung Executive Buys More Shares
TechFlowPost
2026-07-31 02:32:55

TechFlowPost frames the new Cold War as a technology-and-finance contest

TechFlowPost published an opinion article on July 31 arguing that finance functions as a tool of social mobilization and that the latest phase of great-power rivalry is moving beyond classic trade conflict into a technology-and-finance struggle. Written by Zuoye, the piece revisits three historical arcs — the U.S.-Soviet Cold War, U.S.-Japan friction, and the current U.S.-China rivalry — and argues that Washington’s pattern has often started with trade pressure before shifting toward financial instruments. In the author’s reading, the Soviet bloc’s dependence on the dollar system, Japan’s post-Plaza demand for U.S. Treasuries, and China’s current position inside a deeply intertwined global system all show different stages of the same strategic logic. The article also argues that stock markets are taking on a more political role, with U.S. equities, especially AI and semiconductor names, described as a new form of “sovereign-grade asset.” It further claims that the latest technology contest is increasingly expressed through financial pricing, equity benchmarks, and capital-market positioning rather than through trade shares alone. The piece is presented as a historical and strategic commentary rather than a report on a single market event.

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TechFlowPost frames the new Cold War as a technology-and-finance contest