CCL stocks rebound as supply chain pushes back on downgrade claims tied to CPO
A market rumor that co-packaged optics, or CPO, could replace high-speed copper transmission and drag motherboard copper clad laminate specifications down to M4 triggered a sharp sell-off in Taiwan’s CCL names on Sept. 17. Elite Material fell to limit down, while EMC and Taiwan Union Technology dropped more than 7% and 6%, respectively. The move drew attention because it came even as the broader Taiwan market rose 0.96% to 46,288 points. Supply chain sources and institutions later challenged that narrative on X, arguing that the market had overstated both the pace of CPO adoption and its impact on high-end CCL demand. Their case centered on three points: CPO is still largely confined to scale-out switches, not scale-up interconnects inside GPU clusters; it addresses signal loss and power consumption in long-distance high-speed transmission rather than eliminating all internal electrical links in servers; and even if upgrade priorities shift, each new motherboard generation is still expected to move to higher specifications. GF Securities Managing Director Jeff Pu added that CPO is unlikely to enter server compute motherboards in the near term, and that even next year’s NVSwitch NPO/CPO version will still use a hybrid structure built on PTFE substrates and M8/M9 ultra-low-loss CCL. By noon on Sept. 18, all three major CCL stocks had turned positive.








