Longtan science park expansion restarts as TSMC signals interest in 1.4 nm fabs
The long-delayed third-phase expansion of the Longtan Science Park has been revived after more than two years of setbacks tied to land expropriation disputes. According to ABMedia, citing a Liberty Times report, local sentiment in Longtan shifted after residents saw the economic spillover created by Taiwan Semiconductor Manufacturing Co. (TSMC) plants in southern Taiwan, including Tainan, Kaohsiung, and Chiayi. Supply chain sources said TSMC is planning three facilities for the site: two 1.4 nm wafer fabs and one panel-level packaging, or PLP, plant. The project was originally designed to cover 158.59 hectares, with 88% of the land privately owned, triggering strong opposition and organized protests. TSMC later announced on Oct. 17, 2023 that it would abandon its Longtan plant plan. Since then, the project scope has been revised several times, first to 89.63 hectares in 2024 and later to 104.19 hectares, of which about 46 hectares are designated for industrial use. Taiwan’s National Science and Technology Council said the expansion plan passed review by the Science Park Review Committee in May and was submitted to the Executive Yuan in June. Under the current timetable, land acquisition is targeted for completion by the end of 2029, with public infrastructure construction scheduled to begin in 2030.
